RAM-Stack™
Viking InterWorks has developed RAM-Stack™, an innovative stacking technology, to support the need for high density modules, space constrained systems and temperature sensitive environments. This innovative stacking technology was specifically engineered to meet the extreme demands of the Server, HPC (High Performance Computing), Telecommunications & Embedded markets.
RAM-Stack™ has multiple benefits over other contemporary stacking solutions including:
- Excellent signal integrity
- High reliability
- Superior thermal characteristics
- Industry-leading (4 high) quad stack
- Highest densities
Power, Thermal & Reliability Benefits
The RAM-Stack™ design has superior thermal characteristics when compared to other stacking technologies available in the market today. The key lies in the ability for RAM-Stack™ to get the heat out of the DRAM die more efficiently than other competitive solutions. Therefore, at the same power level as modules built with other stacking technologies, the RAM-Stack™ DRAM junction temperatures run lower (a lower junction to case & junction to board thermal resistance). This means that RAM-Stack™ built modules exhibit a higher long-term reliability & less tendency for retention related ECC errors.
Volumetric Density
Any RAM-Stack™ module of equal capacity & configuration to a BGA stacked module has a superior volumetric density (i.e thinner). Having a superior volumetric density allows system designers to utilize their cooling & power restrictions more efficiently. For example, system boards populated with thinner RAM-Stack™ modules will have wider gaps between each module, thus by having lower air resistance the result is a superior cooling environment.
To turn this into cost savings, system designers have the option of using lower fan speeds or lower power fans (power saving) to keep the system at the required temperature.
Electricity Costs of Power & Cooling
Gartner Says 50 Percent of Data Centers Will Have Insufficient Power & Cooling Capacity by 2008. (Gartner 11/06)
The cost of electricity to cool server farms accounts for about 50% of the power bill.
(J.Koomey. Professor at Stanford University)
Module Availability
DDR2 240-pin VLP (18.30mm) Registered DIMM
- 8GB 4 Rank (1Gb Die) Quad Stack
- 4GB 4 Rank (512Mb Die) Quad Stack
- 4GB 2 Rank (1Gb Die) Dual Stack
DDR2 240-pin LP (30mm) Registered DIMM
- 8GB 4 Rank (1Gb Die) Dual Stack
- 4GB 4 Rank (512Mb Die) Dual Stack
DDR2 244-pin (30mm) MiniRDIMM
- 8GB 4 Rank (1Gb Die) Quad Stack
- 4GB 4 Rank (512Mb Die) Quad Stack
DDR1 184-pin VLP (18.30mm) Registered DIMM
- 4GB 4 Rank (512Mb Die) Quad Stack
- 2GB 2 Rank (512Mb Die) Dual Stack
DDR1 184-pin LP (30mm) Registered DIMM
- 4GB 4 Rank (512Mb Die) Dual Stack
- 2GB 2 Rank (512Mb Die) Single Die
For more information, contact: sales@vikinginterworks.com